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    • Survey of semiconductor wafer defect detection method based on machine vision

    • The development of integrated circuit technology cannot be separated from semiconductor wafers, and defect detection is crucial to ensure chip performance. This article summarizes the research progress of wafer defect detection methods, providing solutions for improving wafer yield and productivity.
    • Vol. 30, Issue 1, Pages: 25-50(2025)   

      Received:01 February 2024

      Revised:2024-04-29

      Published:16 January 2025

    • DOI: 10.11834/jig.240053     

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  • Hu Zhiqiang, Wu Yiquan. 2025. Survey of semiconductor wafer defect detection method based on machine vision. Journal of Image and Graphics, 30(01):0025-0050 DOI: 10.11834/jig.240053.
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相关作者

Cheng Longhao 中国科学技术大学人工智能与数据科学学院
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Fu Hao 浙江大学计算机科学与技术学院
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Tu Jiahang 浙江大学计算机科学与技术学院
Zhao Hanbin 浙江大学计算机科学与技术学院

相关机构

School of Artificial Intelligence and Data Science, University of Science and Technology of China
School of Mathematics Sciences, University of Science and Technology of China
College of Computer Science and Software Engineering, Shenzhen University
College of Computer Science and Technology, Zhejiang University
College of Information Science and Electronic Engineering, Zhejiang University
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